Day 1 at CIOE 2026: GMY Showcases 172 nm Excimer Solutions for Precision Semiconductor Manufacturing

GMY showcased its 172 nm excimer solutions at Booth 14C108 on the opening day of CIOE 2026, held alongside IICIE and elexcon at the Shenzhen World Exhibition & Convention Center.

Bringing together professionals from the optoelectronics and integrated circuit industries, the events provided an opportunity to explore applications of excimer technology in precision semiconductor manufacturing and discuss the development of this technology in China.

Conversations on practical applications

On the first day, GMY welcomed industry experts, engineers and procurement professionals to its booth. Discussions focused on the practical benefits of 172 nm excimer technology, its applications in advanced manufacturing and its potential for volume production.

These exchanges connected specific process requirements with GMY’s expertise in excimer light sources and application development.

Solutions for key semiconductor manufacturing processes

Developed through ongoing R&D and process refinement, GMY’s 172 nm excimer range supports applications in semiconductor and display panel manufacturing. Featured products include:

• 172 nm Excimer Light Source

With a narrow emission bandwidth and stable output, this light source enables non-contact processing with minimal thermal stress, making it suitable for precision applications involving heat-sensitive materials.

• 172 nm Excimer Modules

①172 nm MINI Laboratory Module

Designed for semiconductor process R&D, process validation and small-batch pilot production, this compact module is easy to set up and relocate, with manageable costs.

②Wafer UV Cleaning Module

Designed to remove nanoscale organic contaminants from wafer surfaces, this module helps improve yield in subsequent coating and bonding processes while supporting process precision and stability.

③High-Energy UV System

Designed for experimental validation and application development, this system helps shorten validation cycles and speed up the transition from lab testing to practical use. Applications include UV cleaning, UV curing and UV-induced modification.

④172 nm Ultrapure Water TOC Reduction Module

Designed for ultrapure water systems in semiconductor fabs, this mercury-free module uses UV light to reduce total organic carbon (TOC) without chemical additives. It helps maintain water purity for critical processes such as cleaning and etching, supporting improved manufacturing yield.

• Rapid Thermal Processing (RTP) Solutions

Based on radiative heating from halogen lamp arrays, these systems deliver precise, non-contact thermal processing with high temperature uniformity and rapid heating and cooling. They support thermal treatment of wafers, thin films, silicon carbide (SiC) and other advanced materials, helping improve film quality and device electrical performance.

Visit GMY at Booth 14C108

The exhibition runs through September 11, 2026. Join us at Booth 14C108 at the Shenzhen World Exhibition & Convention Center to explore our 172 nm excimer solutions and discuss your process requirements with our team.

Discover how excimer technology can support precision manufacturing, improve quality and reduce costs in semiconductor and integrated circuit production.