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English English Views: 4676 Author: GMY Publish Time: 2025-06-03 Origin: GMY
In the semiconductor industry, chip manufacturing is often regarded as “nano-scale precision engraving” — constructing billions of transistors on a silicon wafer only a few square centimeters in size. The precision of each process step directly affects device performance, power consumption, and yield.
During manufacturing, factors such as the surface energy, wettability, and cleanliness of the wafer surface have a direct impact on critical processes including thin film deposition, pattern transfer, and bonding. In particular, surface modification and control of substrate conditions are considered essential techniques for improving process stability and yield in high-precision chip manufacturing.
Invitation to Visit Booth 14G22
At this year's China (Shenzhen) International Semiconductor Exhibition, GMY (Booth No. 14G22) will showcase its semiconductor substrate surface activation solution based on 172nm excimer UV light. This solution enhances the surface energy and adhesion of semiconductor substrates, helping customers optimize processes and increase yields.
Applications include pre-treatment for thin film deposition, MEMS packaging, 3D packaging, wafer bonding, flip-chip bonding, wire bonding, and other high-precision chip manufacturing processes.
When irradiating material surfaces with 172nm excimer UV light, the high-energy photons cleave organic molecular chains. Simultaneously, oxygen in the air is activated to produce reactive oxygen species such as oxygen ions, ozone, and hydroxyl radicals. These reactive species interact with the material surface, introducing polar groups such as hydroxyl and carboxyl groups, thereby increasing surface free energy and enabling controllable surface activation and adjustment.
√ Low thermal effect, compatible with various sensitive materials
√ Significantly improves surface energy, enables contact angle control, and optimizes surface tension
√ Non-contact, atmospheric-pressure processing, suitable for irregular and large-sized substrates
√ No chemical residues, ensuring clean processing environments
Three horizontal lines from top to bottom indicate 30, 35, and 40 mN/m dyne pens, with photographs taken after 5 minutes.
From June 4 to 6, we sincerely invite you to visit GMY at Booth 14G22, Hall 14, at the China (Shenzhen) International Semiconductor Exhibition. Learn about GMY’s 172nm excimer ultraviolet light sources and surface modification solutions, and exchange insights on the application of lighting technology in advanced semiconductor processing. We look forward to discussing potential collaboration opportunities with you.
