Views: 5672 Author: GMY Publish Time: 2025-04-23 Origin: GMY
In semiconductor manufacturing, cleaning processes are integral to key stages such as lithography, etching, and deposition, and play an important role in the preparation of monocrystalline silicon wafers. As technology advances, chip manufacturing processes have progressed to the 28nm, 14nm, and even more advanced nodes. The sensitivity of wafers to microscopic contaminants has also significantly increased. Prior to each processing step, it is necessary to remove particles, organic matter, metallic impurities, and oxide layers from the wafer surface to ensure the smooth progress of subsequent processes. For example, in 7nm and below manufacturing processes, if there are more than three 0.5nm particles per square centimeter on the wafer surface, the yield rate could decline by 12%-18%.
As a critical step in advanced semiconductor processes, wafer surface cleaning is evolving towards higher efficiency and lower damage. In response to nanometer-scale organic contaminants, 172nm excimer ultraviolet photocleaning technology offers a non-contact, high-precision cleaning solution, and has increasingly become a focus of industry applications and technical development. However, the 172nm excimer light sources required for this technology have long relied on imports, facing issues such as high costs, unstable supply, and technological restrictions. With the ongoing restructuring of global industrial chains and heightened awareness of supply chain security, the demand for domestic alternatives has become increasingly urgent.
This technology uses 172nm high-energy ultraviolet light to excite organic contaminants, generating free radicals that undergo photosensitive oxidation reactions with oxygen radicals, effectively decomposing pollutants into water and carbon dioxide to achieve atomic-level cleanliness.
172nm Flat Panel Light Source
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Technical Advantages:
√ Non-Thermal Treatment: Cold light source technology avoids thermal stress, making it suitable for heat-sensitive materials.
√ High Cleaning Efficiency: Effectively removes nanometer-scale organic residues, improving process yields.
√ Excellent Stability: Long-life design ensures stable and reliable performance.
√ Reliable Delivery: Backed by an experienced manufacturer of 172nm excimer light sources and equipment, with guaranteed delivery capability.
√ Flexible Customization: Equipment and solutions can be customized to meet specific customer requirements.
Application Fields:
√ Semiconductor wafer cleaning and photoresist stripping
√ Optical lens cleaning
√ LCD/OLED production (removal of photoresist residues)
√ High-precision PCB surface treatment
Specifically designed for wafer photocleaning, this module efficiently removes nanometer-scale organic contaminants and residual adhesives, improving yields in subsequent coating and bonding processes.
√ Long-Life Design: Cathode material optimization and precise gas mixture control ensure stable output for 2,500 hours.
√ Non-Damaging Processing: Cold light source characteristics avoid thermal stress-induced wafer warping.
√ Cooling Options: Available in air-cooled and water-cooled configurations, flexibly adjustable based on cleanroom requirements.
GMY has been engaged in lighting technology application R&D and manufacturing for over two decades, specializing in 172nm excimer light sources, equipment, and modules, covering key fields such as photocleaning, photocuring, photomodification, and ultrapure water treatment. With proven capabilities in R&D innovation, equipment design, and customization, GMY provides core optical components and solutions required from experimental verification to mass production, supporting domestic high-end manufacturing in achieving independent and controllable production, and ensuring the security and stability of the industrial supply chain.