The 2025 Shanghai International Semiconductor Technology Conference and Exhibition will be held from July 29 to 31, 2025, at the National Exhibition and Convention Center (Hongqiao), Shanghai. As a large-scale and influential event in the semiconductor industry, it will showcase innovative products, advanced technologies, application solutions, and business cooperation models. The event aims to provide a one-stop matchmaking platform for upstream and downstream enterprises across the sector.

Invitation

Dear Sir/Madam,

We sincerely invite you to attend the 2025 Shanghai International Semiconductor Technology Conference and Exhibition.

GMY (Booth No.: Hall 4.1H, 3-B12-1) will showcase diverse application solutions featuring our 172nm excimer light source for semiconductor manufacturing. We look forward to in-depth exchanges with industry experts, partners, and customers to explore the application prospects and collaboration opportunities of lighting technology in advanced semiconductor processes.

With best regards,

GMY Lighting Technology Co., Ltd.

July 2025

172nm Excimer Lighting Technology Solutions: Enhancing Efficiency and Reducing Costs in the Semiconductor Industry

At this exhibition, GMY will highlight a range of applications of its 172nm excimer light source in semiconductor processing, including wafer cleaning, surface modification, ultrapure water TOC treatment, and process validation and development—aimed at offering the industry efficient, environmentally friendly, and customizable process optimization solutions.

1. Wafer/Photomask Photocleaning Solution

Function: Efficient removal of microscopic organic contaminants from wafer and photomask surfaces, achieving ultra-clean surfaces.

Advantages: No chemical residues, low-temperature, damage-free processing, atomic-level cleanliness.

Applications: Cleaning organic contaminants from wafers, photomasks, display panels, PET, and PCBs; pretreatment before packaging; photoresist removal.

2. Wafer Bonding Surface Modification Solution

Function: Precisely tunes surface hydrophilicity and adhesion properties to improve bonding strength.

Advantages: Minimal thermal effect, fast processing, no chemical residues.

Applications: Pretreatment before thin-film deposition, MEMS packaging, 3D integration, wafer bonding, flip-chip and wire bonding in high-precision chip manufacturing.

3. Ultrapure Water TOC Degradation Solution

Function: Effectively degrades Total Organic Carbon (TOC) in ultrapure water systems, achieving ppb-level purity.

Advantages: No chemical additives, continuous in-line degradation, stable and reliable performance.

Applications: Ultrapure water systems used in semiconductor wafer processing and display panel manufacturing.

4. Process Validation and Development Solution

Specifically designed for semiconductor process R&D, verification, and small-scale trial production, the 172nm MINI experimental module features a compact structure, easy deployment, portability, and cost-effectiveness—ideal for a variety of experimental environments and process validation scenarios.

Function: Efficiently decomposes organic residues on wafer surfaces to enhance cleanliness and adhesion.

Advantages: Highly integrated, lightweight design, easy to set up in laboratory environments.

Applications: Organic surface contaminant removal, surface activation and modification, packaging pretreatment, and validation of ultra-clean, ultra-fine cleaning processes.

GMY warmly welcomes industry professionals to visit our booth for hands-on discussions on the practical applications and innovative outcomes of lighting technology in semiconductor manufacturing. Let's explore collaboration opportunities and jointly contribute to the high-quality advancement of the industry.