Invitation: GMY Invites You to SEMI-e Shenzhen International Semiconductor Exhibition

GMY sincerely invites you to attend the 7th SEMI-e Shenzhen International Semiconductor Exhibition & 2025 Integrated Circuit Industry Innovation Expo. The exhibition will take place from September 10–12, 2025, at the Shenzhen World Exhibition & Convention Center (Bao'an New Venue). GMY will present its 172nm excimer light application solutions and innovative products, engaging with global industry professionals to explore semiconductor technology trends and jointly promote industrial advancement.

Exhibition Guide

Event: SEMI-e Shenzhen International Semiconductor Exhibition & 2025 Integrated Circuit Industry Innovation Expo

Date: September 10–12, 2025

Venue: Shenzhen World Exhibition & Convention Center (Bao'an)

Booth No.: 13G27

Exhibit Highlights

GMY will showcase a series of application solutions based on 172nm excimer light technology, covering key stages in semiconductor manufacturing:

Wafer/Photomask Photocleaning Solutions

Function: Efficiently removes microscopic organic contaminants from wafer and photomask surfaces, achieving ultra-clean processing.

Advantages: No chemical residues, low-temperature and non-destructive, atomic-level cleanliness.

Applications: Cleaning of organic contaminants on wafers, reticles, photomasks, displays, PET, and PCBs; pre-packaging surface treatment; photoresist removal.

Example: 172nm cleaning of nanoimprint molds to improve cleanliness

Wafer Bonding Photomodification Solutions

Function: Precisely adjusts surface hydrophilicity and adhesion to enhance bonding performance.

Advantages: Low thermal effect, fast processing, no chemical residues.

Applications: Pre-treatment for thin-film deposition, MEMS packaging, 3D packaging, wafer bonding, flip-chip, and wire bonding in advanced chip manufacturing.

Example: Hydrophilicity increases after irradiation, with a significantly reduced contact angle

Ultra-Pure Water TOC Degradation Solutions

Function: Efficiently degrades Total Organic Carbon (TOC) in ultra-pure water systems, achieving ppb-level purity.

Advantages: No chemical additives, online degradation, stable and reliable.

Applications: Ultra-pure water systems in semiconductor wafer fabrication and display panel production.

Example: Principle of TOC degradation in ultra-pure water

Process Verification and Development Solutions

Specially designed for semiconductor process R&D, validation, and small-scale pilot runs, the 172nm MINI experimental module features a compact structure, easy deployment, flexible mobility, and cost control, suitable for diverse experimental settings and process verification needs.

Function: Efficiently decomposes organic residues on wafer surfaces, improving cleanliness and adhesion.

Advantages: Highly integrated and lightweight design, convenient for laboratory setup.

Applications: Removal of surface organic contaminants, surface activation and modification, pre-packaging treatment, and verification of ultra-clean fine cleaning processes.

Example: 172nm MINI experimental module

GMY sincerely invites you to visit our booth (13G27) to explore our innovative lighting technology application solutions and discuss the future development of the semiconductor industry.