From September 4 to 6, the 13th Exhibition on Semiconductor Equipment, Core Components and Materials (CSEAC 2025) will take place at the Wuxi Taihu International Expo Center. Under the theme “Strengthening China’s Chip Industry, Embracing the World of Chips”, the event will bring together leading domestic and international enterprises and cutting-edge technologies. It serves as an important annual platform for China’s semiconductor equipment, core components, and materials sector, integrating technology exchange, exhibition displays, product launches, business negotiations, international cooperation, and market development.

GMY will showcase its 172nm excimer light sources and modules at the exhibition, highlighting applications in wafer cleaning, surface modification, ultrapure water TOC treatment, and process verification and development. We sincerely invite you to visit GMY’s booth (B1-219) for in-depth discussions on industry trends and potential cooperation opportunities.

Exhibit Preview

172nm Excimer Light Source

Photocleaning

Uses 172nm high-energy UV light to generate free radicals that oxidize and decompose organic contaminants on the surface, achieving atomic-level cleanliness.

Surface Modification

Introduces -OH polar groups to material surfaces, increasing surface energy and hydrophilicity, and improving adhesion performance in subsequent processes.

TOC Degradation

Employs 172nm UV oxidation technology to effectively break down organics in water into CO₂ and H₂O, lowering TOC levels to the ppb level.

Photocuring

High-energy photons rapidly initiate polymerization, enabling efficient surface curing with advantages of high speed, low energy consumption, and environmental compatibility.

172nm Excimer Modules and Equipment

172nm MINI Experimental Module

Designed for semiconductor process R&D, process validation, and small-scale pilot production, this compact module offers convenient deployment, flexibility, mobility, and cost control, suitable for diverse experimental environments and validation needs.

High-Energy UV 

Instrument

Supports experimental verification and application development, significantly shortening validation cycles and accelerating application deployment. Applicable to photocleaning, photocuring, and photomodification.

Wafer Photocleaning

Module

Specifically developed for wafer substrate photocleaning, this module efficiently removes nanoscale organic contaminants, improving yield in subsequent coating and bonding processes.

Comprehensive Customization Services

Based on the requirements of high-end manufacturing processes, GMY provides customized 172nm excimer light sources and modules, covering different stages from experimental validation to mass production, supporting the realization of more efficient and reliable process solutions.

GMY looks forward to meeting you at CSEAC 2025 to exchange insights on advanced technologies, share practical experience, and explore further opportunities for collaboration.